MOSIS WAFER ACCEPTANCE TESTS RUN: T68Y (7RF_6LM_ML) VENDOR: IBM-BURLINGTON TECHNOLOGY: SCN018 FEATURE SIZE: 0.18 microns Run type: SKD INTRODUCTION: This report contains the lot average results obtained by MOSIS from measurements of MOSIS test structures on each wafer of this fabrication lot. SPICE parameters obtained from similar measurements on a selected wafer are also attached. COMMENTS: 7RF_IBM-BURLIN TRANSISTOR PARAMETERS W/L N-CHANNEL P-CHANNEL UNITS MINIMUM 0.24/0.18 Vth 0.46 -0.43 volts SHORT 20.0/0.18 Idss 569 -282 uA/um Vth 0.47 -0.44 volts Vpt 4.5 -4.1 volts WIDE 20.0/0.18 Ids0 120.6 -167.8 pA/um LARGE 20.0/20.0 Vth 0.36 -0.42 volts Vjbkd 3.8 -4.2 volts Ijlk <50.0 <50.0 pA K' (Uo*Cox/2) 153.3 -32.1 uA/V^2 Low-field Mobility 390.68 81.81 cm^2/V*s PROCESS PARAMETERS N+ P+ POLY P+PLY M1 M2 UNITS Sheet Resistance 6.3 6.1 6.3 252.9 0.08 0.09 ohms/sq Contact Resistance 7.5 7.4 6.9 2.31 ohms Gate Oxide Thickness 44 angstrom PROCESS PARAMETERS M3 M4 M5 N+BLK P+BLK M6 RP POLY_NON TaN UNITS Sheet Resistance 0.09 0.10 0.10 67.2 105.2 0.01 163.7 1750.7 61.1 ohms/sq Contact Resistance 4.41 6.53 8.69 8.70 ohms COMMENTS: BLK is silicide block. CAPACITANCE PARAMETERS N+ P+ POLY D_N_W R_W N_W UNITS Area (substrate) 809 1156 373 189 aF/um^2 Area (N+active) 7809 aF/um^2 Area (P+active) 7426 aF/um^2 Area (r well) 902 aF/um^2 Area (d well) 1326 aF/um^2 Fringe (substrate) 187 111 aF/um Overlap (N+active) 442 aF/um Overlap (P+active) 525 aF/um CIRCUIT PARAMETERS UNITS Inverters K Vinv 1.0 0.77 volts Vinv 1.5 0.82 volts Vol (100 uA) 2.0 0.01 volts Voh (100 uA) 2.0 1.78 volts Vinv 2.0 0.86 volts Gain 2.0 -16.92 Ring Oscillator Freq. D1024_THK (31-stg,3.3V) 221.82 MHz DIV512 (31-stg,1.8V) 446.72 MHz Ring Oscillator Power D1024_THK (31-stg,3.3V) 0.08 uW/MHz/gate DIV512 (31-stg,1.8V) 0.02 uW/MHz/gate