Course Details

Course details of EE5340
Course NoEE5340
Course TitleMicro Electro Mechanical Systems
Credit9
Course ContentIntroduction to MEMSSurface micromachining, Oxide anchored Cantilever beam, poly anchored beamsLPCVD poly silicon deposition, doping, oxidationTransport in PolySi, 2 and 3 terminal beamsBulk micromachining; Wet etching –isotropic and anisotropic; Etch stop – Electrochemical etching; Dry etching; BondingComparison of bulk and Surface micromachining: LIGA; SU-8; Moulding processes;Stiction: process, in-use, Measuring stictionPull-in parallel plate capacitorPressure Sensor: piezo-resisitivity, Diffused Si, Poly, porous SiBeams: Structure; force, moments, equation, spring constant; Stress, pull-in, pull-out; resonance freq, etcAccelerometer. Quasi-static, capacitive, equivalent circuit; Analog; Tunnel; Thermal accelerometerRate GyroscopeBiosensor and BioMEMS; Microfluidics; Digital Microfluidics; Ink jet printerOptical MEMS: Displays -DMDs, LGVs, active and passive componentsRF MEMS: switches, active and passive componentsPackaging; ReliabilityScalingOther materials/ actuatorsBy TAsMEMS software training: COMSOL & IntellisuiteSome process technology (Litho, oxidation, etc)
Course Offered this semesterNo
Faculty Name