Title : MicroElectroMechanical Systems
Course No : EE5340
Credits : 3
Prerequisite :

Syllabus :

  • Introduction to MEMS
  • Surface micromachining, Oxide anchored Cantilever beam, poly anchored beams
  • LPCVD poly silicon deposition,  doping,  oxidation
  • Transport  in PolySi, 2 and 3 terminal beams
  • Bulk micromachining; Wet etching –isotropic and anisotropic; Etch stop – Electrochemical etching; Dry etching;  Bonding
  • Comparison of bulk and Surface micromachining: LIGA; SU-8; Moulding processes;
  • Stiction: process, in-use, Measuring stiction
  • Pull-in parallel plate capacitor
  • Pressure Sensor: piezo-resisitivity, Diffused Si, Poly, porous Si
  • Beams: Structure; force, moments, equation, spring constant;  Stress, pull-in, pull-out; resonance freq, etc
  • Accelerometer. Quasistatic, capacitive, equivalent circuit; Analog;  Tunnel; Thermal accelerometer
  • Rate Gyroscope
  • Biosensor and BioMEMS; Microfluidics; Digital Microfluidics; Ink jet printer
  • Optical MEMS: Displays -DMDs, LGVs, active and passive components
  • RF MEMS: switches, active and passive components
  • Packaging; Reliability
  • Scaling
  • Other materials/ actuators
  • By TAs
  • MEMS software training: COMSOL & Intellisuite
  • Some process technology (Litho, oxidation, etc)

Text Books :

  • Microsystems design, Senturia
  • Microfabrication, Madou
  • Polycrystalline Si, Ted Kamins

 References :